AD664JN-BIP Overview

As part of the 28-DIP (0.600, 15.24mm) package, it is included. This FPGA module can be attached to the development board with a Through Hole. When operating the machine, it is important to keep the temperature within 0°C~70°C range. It is designed to maximiTubee space efficiency by containing the FPGA model in Tube. The device package supplied by 28-PDIP is one of its suppliers.

AD664JN-BIP Features

28-DIP (0.600, 15.24mm) package

AD664JN-BIP Applications

There are a lot of Rochester Electronics, LLC AD664JN-BIP Digital to Analog Converters (DAC)?applications.

• Low bandwidth data acquisition systems
• Digital Offset & Gain Adjustment
• Synchro Applications
• Automated Test Equipment
• LMDS/MMDS, point-to-point
• Gain and offset adjustment
• Digital Radio Link
• Voltage Set Point Control
• General Purpose Trimming Adjustments
• Wireless infrastructure: