AD664KN-BIP

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Manufacturer part number:AD664KN-BIP

Manufacturer:Rochester Electronics, LLC

Description:DACVoltage - BufferedThrough Hole R-2R R

Case Package:SOT-23

Datasheet:AD664KN-BIP Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Through Hole
Package / Case	28-DIP (0.600, 15.24mm)
Supplier Device Package	28-PDIP
Operating Temperature	0°C~70°C
Packaging	Tube
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Output Type	Voltage - Buffered
Number of Bits	12
Architecture	R-2R
Reference Type	External
Data Interface	Parallel
Differential Output	No
Voltage - Supply, Analog	±11.4V~16.5V
Voltage - Supply, Digital	5V
Settling Time	10μs
INL/DNL (LSB)	±0.5, ±0.5 (Max)
Number of D/A Converters	4
RoHS Status	Non-RoHS Compliant

Quantity	Unit Price	Ext. Price
1	$137.17000	$137.17
500	$135.7983	$67899.15
1000	$134.4266	$134426.6
1500	$133.0549	$199582.35
2000	$131.6832	$263366.4
2500	$130.3115	$325778.75

AD664KN-BIP Overview

A 28-DIP (0.600, 15.24mm) package is provided with this component. An FPGA module can be attached to a development board with a Through Hole-pin. It is recommended that the operating temperature be kept within the range 0°C~70°C while the machine is operating. This FPGA model is contained in Tube for space saving. The device package supplied by 28-PDIP is one of its suppliers.