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AD7849BR

AD7849BR

AD7849BR

Rochester Electronics, LLC

DACVoltage - BufferedSurface Mount String DAC R7.5mm mm

SOT-23

AD7849BR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tube
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Terminal Finish TIN LEAD
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 15V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 20
JESD-30 Code R-PDSO-G20
Qualification Status COMMERCIAL
Output Type Voltage - Buffered
Number of Bits 16
Architecture String DAC
Converter Type D/A CONVERTER
Reference Type External
Data Interface SPI
Differential Output No
Voltage - Supply, Analog ±14.25V~15.75V
Voltage - Supply, Digital 5V
Settling Time 10μs (Typ)
Input Bit Code BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
INL/DNL (LSB) ±16 (Max), ±0.9 (Max)
Negative Supply Voltage-Nom -15V
Input Format SERIAL
Number of D/A Converters 1
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS Status Non-RoHS Compliant
AD7849BR Product Details

AD7849BR Overview


In the package 20-SOIC (0.295, 7.50mm Width), this product is provided. In order to operate it, a voltage supply of 15V volts is required. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~85°C at all times. It is for space saving reasons that this FPGA model is contained in Tube. In total, it has a total of 20 terminations. The device has a total of 20 pins on it.

AD7849BR Features


20-SOIC (0.295, 7.50mm Width) package
20 pin count

AD7849BR Applications


There are a lot of Rochester Electronics, LLC AD7849BR Digital to Analog Converters (DAC)?applications.

  • Direct Digital Waveform Generation
  • Wideband communications:
  • Microprocessor Controlled Calibration
  • Portable Equipment
  • Bus Structured instruments
  • Low Power Systems
  • Wireless infrastructure:
  • Video Encoder
  • Microprocessor Controlled Circuits
  • LMDS/MMDS, point-to-point

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