CYF0072V18L-133BGXI Overview

209-BGA is the package in which FIFO memory chip is contained.Tray case is used for packaging.There is a memory of 72M 2M x 36 on the FIFO chip that can be used to store applications and data.A temperature regulation of -40°C~85°C is crucial for reliable operation.This FIFO memory has a mounting type of Surface Mount .A 1.7V~1.9V supply voltage is required to power it.

CYF0072V18L-133BGXI Features

72M 2M x 36 memory size

CYF0072V18L-133BGXI Applications

There are a lot of Rochester Electronics, LLC
CYF0072V18L-133BGXI FIFOs Memory applications.

• Routers
• Cameras
• Multimedia
• TVs
• Computers
• Disk Controllers
• Communications
• Networking
• Multi-stage synchronizer
• Signal processing