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CYP15G0201DXB-BBI

CYP15G0201DXB-BBI

CYP15G0201DXB-BBI

Rochester Electronics, LLC

Telecom device2 Circuits

SOT-23

CYP15G0201DXB-BBI Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-FBGA (15x15)
Operating Temperature -40°C~85°C
Packaging Tray
Series HOTlink II™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Transceiver
Interface LVTTL
Number of Circuits 2
Current - Supply 570mA
RoHS Status Non-RoHS Compliant
CYP15G0201DXB-BBI Product Details

CYP15G0201DXB-BBI Overview


The 196-LBGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.There are 2 circuits in this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The supply current is 570mA.With its similar functionality to electronic parts under the HOTlink II? series, it can perform a number of similar tasks.

CYP15G0201DXB-BBI Features


Available in the 196-LBGA package

CYP15G0201DXB-BBI Applications


There are a lot of Rochester Electronics, LLC CYP15G0201DXB-BBI Telecom applications.

  • Intelligent PBX
  • Interfaces to DS3
  • Inverse Multiplexing for ATM (IMA)
  • E2 Rates PCM Line Interface
  • Fiber
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • PDH Multiplexers
  • Remote wireless modules
  • E1 LAN/WAN Routers
  • Home Gateway

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