In the package 28-DIP (0.600, 15.24mm), this product is provided. An FPGA module can be attached to a development board with a Through Hole-pin. When operating the machine, it is important to keep the temperature within 0°C~70°C range. As a space-saving measure, this FPGA model is contained within Tube. This device package is supplied by 28-PDIP.
DAC725JP Features
28-DIP (0.600, 15.24mm) package
DAC725JP Applications
There are a lot of Rochester Electronics, LLC DAC725JP Digital to Analog Converters (DAC)?applications.