A 28-DIP (0.600, 15.24mm) package is provided with this component. The Through Hole-slot connector on the FPGA module can be connected to the development board. Operating temperatures should be maintained within the 0°C~70°C range at all times when the unit is in use. It is for space saving reasons that this FPGA model is contained in Tube. 28-PDIP stands for its supplier device package.
DAC725KP Features
28-DIP (0.600, 15.24mm) package
DAC725KP Applications
There are a lot of Rochester Electronics, LLC DAC725KP Digital to Analog Converters (DAC)?applications.