DAC813JP Overview

There is a 28-DIP (0.300, 7.62mm) package that includes this component. FPGA modules can be attached to development boards using a Through Hole-connector. During the operation of the system, the operating temperature should remain within the range of -40°C~85°C. Using the Tube layout, this FPGA model can be contained in a very small amount of space. Device package 28-PDIP is provided by its supplier.

DAC813JP Features

28-DIP (0.300, 7.62mm) package

DAC813JP Applications

There are a lot of Rochester Electronics, LLC DAC813JP Digital to Analog Converters (DAC)?applications.

• Wideband communications:
• Digital Audio Amplifiers
• LMDS/MMDS, point-to-point
• Microprocessor Controlled Circuits
• Automatic Test Equipment
• Precision AGC Circuits
• General Purpose Trimming Adjustments
• High-End Compact Disc Players
• Servo controls
• Digital Offset & Gain Adjustment