DS2175N Overview

In order to save space on the board, the 16-DIP (0.300, 7.62mm) package is used.A Tube-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Through Hole.The telecom IC is composed of 1 circuits.Wtelecom IC's efficiencyh a high supply voltage, 4.5V~5.5V can be operated more efficiently.A temperature setting of -40°C~85°C ensures reliable performance.The configuration includes 16 terminations.It requires a supply voltage of 5V.It uses the ELASTIC BUFFER IC type for its telecom IC.9mA is the supply current.

DS2175N Features

Available in the 16-DIP (0.300, 7.62mm) package
ELASTIC BUFFER as telecom IC type

DS2175N Applications

There are a lot of Rochester Electronics, LLC DS2175N Telecom applications.

• Digital access cross connects
• Fiber Optic Terminals
• High speed data transmission line cards
• Routers
• SONET/SDH terminal
• ISDN terminal adapter
• Add/Drop multiplexers (ADMs)
• Digital subscriber line access multiplexer (DSLAM)
• BITS Timing
• Multichannel DS1 Test Equipment