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HC55185ECRZ

HC55185ECRZ

HC55185ECRZ

Rochester Electronics, LLC

Telecom device1 Circuits

SOT-23

HC55185ECRZ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 32-VQFN Exposed Pad
Supplier Device Package 32-QFN (7x7)
Operating Temperature 0°C~75°C
Packaging Tray
Published 2001
Series RSLIC18
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Subscriber Line Interface Concept (SLIC)
Number of Circuits 1
RoHS Status ROHS3 Compliant
HC55185ECRZ Product Details

HC55185ECRZ Overview


The 32-VQFN Exposed Pad package reduces the amount of space on a board.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.1 circuits make up this telecom IC .The operating temperature set at 0°C~75°C can offer reliable performance.The RSLIC18 series is capable of providing a number of similar functions to the W series.

HC55185ECRZ Features


Available in the 32-VQFN Exposed Pad package

HC55185ECRZ Applications


There are a lot of Rochester Electronics, LLC HC55185ECRZ Telecom applications.

  • DECT (Digital European Cordless Telephone) Base Stations
  • Network Multiplexing and Terminating Equipment
  • LAN Routers
  • SONET/SDH terminal
  • Interfaces to SONET STS-1 Networks
  • Fractional T1/E1/J1
  • Codec function on telephone switch line cards
  • Switching Systems
  • Fiber Optic Terminals
  • E2 Rates PCM Line Interface

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