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LFSC3GA25E-7FFN1020C

LFSC3GA25E-7FFN1020C

LFSC3GA25E-7FFN1020C

Rochester Electronics, LLC

FPGAs SC Series 1020-BBGA, FCBGA

SOT-23

LFSC3GA25E-7FFN1020C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1020-BBGA, FCBGA
Supplier Device Package 1020-OFCBGA (33x33)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SC
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 0.95V~1.26V
Number of I/O 476
Number of Logic Elements/Cells 25000
Total RAM Bits 1966080
Number of LABs/CLBs 6250
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $385.31000 $385.31
500 $381.4569 $190728.45
1000 $377.6038 $377603.8
1500 $373.7507 $560626.05
2000 $369.8976 $739795.2
2500 $366.0445 $915111.25
LFSC3GA25E-7FFN1020C Product Details

LFSC3GA25E-7FFN1020C Overview


A 1020-BBGA, FCBGA package is provided with this component. 476 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 25000 logic elements/cells are required. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 0.95V~1.26V battery. This is a type of FPGA that is part of the SC series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. As far as the RAM bits are concerned, this device offers you a total of 1966080. This FPGA is built as an array of 6250 LABs/CLBs. This device package is supplied by 1020-OFCBGA (33x33).

LFSC3GA25E-7FFN1020C Features


476 I/Os
Up to 1966080 RAM bits

LFSC3GA25E-7FFN1020C Applications


There are a lot of Rochester Electronics, LLC LFSC3GA25E-7FFN1020C FPGAs applications.

  • Data center search engines
  • Industrial IoT
  • Automation
  • Secure Communication
  • Solar Energy
  • Artificial intelligence (AI)
  • Broadcast
  • Security systems
  • Aircraft navigation
  • Integrating multiple SPLDs

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