LFSCM3GA80EP1-6FCN1152C Overview

In the 1152-BBGA package, you will find fpga chips. There are 660 I/Os for better data transfer. A fundamental building block consists of 80000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. A supply voltage of 0.95V~1.26V is needed in order for fpga chips to operate. FPGAs belonging to the SCM series are a type of FPGA that belong to the SCM series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A model of this FPGA is contained in Tray for the purpose of saving space. There are 5816320 RAM bits that are available with this device. A total of 20000 LABs/CLBs make up this FPGA array. The device package supplied by 1152-FCBGA (35x35) is one of its suppliers.

LFSCM3GA80EP1-6FCN1152C Features

660 I/Os
Up to 5816320 RAM bits

LFSCM3GA80EP1-6FCN1152C Applications

There are a lot of Rochester Electronics, LLC LFSCM3GA80EP1-6FCN1152C FPGAs applications.

• Data Mining
• Industrial IoT
• Data Center
• ASIC prototyping
• Industrial Ethernet
• Automotive
• Camera time adjustments
• Telecommunication
• Wired Communications
• Data center hardware accelerators