PowerPC e500 Microprocessor MPC85xx Series 783-BBGA, FCBGA
SOT-23
MPC8543VTANGD Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
783-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
800MHz
Core Processor
PowerPC e500
Voltage - I/O
1.8V 2.5V 3.3V
Ethernet
10/100/1000Mbps (4)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, DDR2, SDRAM
Additional Interfaces
DUART, I2C, PCI, RapidIO
Co-Processors/DSP
Signal Processing; SPE
RoHS Status
ROHS3 Compliant
MPC8543VTANGD Product Details
MPC8543VTANGD Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 783-BBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~105°C TA. The cpu microprocessor belongs to the MPC85xx series. The CPU is cored with a PowerPC e500 processor. The CPU uses DDR, DDR2, SDRAM RAM controllers. This microprocessor features interfaces DUART, I2C, PCI, RapidIO. In this CPU, I/O is set to 1.8V 2.5V 3.3V. Suppliers offer a package of 783-FCPBGA (29x29).
MPC8543VTANGD Features
PowerPC e500 Core
MPC8543VTANGD Applications
There are a lot of Rochester Electronics, LLC MPC8543VTANGD Microprocessor applications.