Shipping overseas is convenient since the embedded microprocessor is packed in 256-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU is cored with a MPC8xx processor. The CPU uses DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. Suppliers offer a package of 256-PBGA (23x23).
MPC875ZT80 Features
MPC8xx Core
MPC875ZT80 Applications
There are a lot of Rochester Electronics, LLC MPC875ZT80 Microprocessor applications.