There are two packages that contain it: 16-TSSOP (0.173, 4.40mm Width) package and X package. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within 0°C~70°C range. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. The device package supplied by 16-TSSOP is one of its suppliers.
TLC7524CPWRG4 Features
16-TSSOP (0.173, 4.40mm Width) package
TLC7524CPWRG4 Applications
There are a lot of Rochester Electronics, LLC TLC7524CPWRG4 Digital to Analog Converters (DAC) applications.
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators