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TLV320AIC12CDBTRG4

TLV320AIC12CDBTRG4

TLV320AIC12CDBTRG4

Rochester Electronics, LLC

TLV320AIC12CDBTRG4 datasheet pdf and Interface - CODECs product details from Rochester Electronics, LLC stock available on our website

SOT-23

TLV320AIC12CDBTRG4 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 30-TFSOP (0.173, 4.40mm Width)
Supplier Device Package 30-TSSOP
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2 (1 Year)
Type Voice-Band
Data Interface Serial
Voltage - Supply, Analog 2.7V~3.6V
Voltage - Supply, Digital 1.65V~1.95V
Resolution (Bits) 16 b
Sigma Delta Yes
Number of ADCs / DACs 1 / 1
Dynamic Range, ADCs / DACs (db) Typ 85 / 92
S/N Ratio, ADCs / DACs (db) Typ 88 / 92
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.59000 $3.59
500 $3.5541 $1777.05
1000 $3.5182 $3518.2
1500 $3.4823 $5223.45
2000 $3.4464 $6892.8
2500 $3.4105 $8526.25
TLV320AIC12CDBTRG4 Product Details

TLV320AIC12CDBTRG4 Overview


For space-saving reasons, it is supplied in a 30-TFSOP (0.173, 4.40mm Width) package. Tape & Reel (TR) packaging method is used. It can perform highly efficiently in various applications since it is a type of Voice-Band. Mounting type Surface Mount is used. When the operating performance is set to 0°C~70°C, the system can operate normally. The unit is integrated with 1 / 1 ADCs / DACs. An analog circuit is supplied with a voltage of 2.7V~3.6V. It is supplied with a voltage of 1.65V~1.95V to power the digital circuit.

TLV320AIC12CDBTRG4 Features


Embedded in the 30-TFSOP (0.173, 4.40mm Width) package
Operating temperature of 0°C~70°C
1 / 1 ADCs / DACs

TLV320AIC12CDBTRG4 Applications


There are a lot of Rochester Electronics, LLC TLV320AIC12CDBTRG4 CODECs Interface ICs applications.

  • High-performance memory system
  • Material handling
  • Linear distance measurement
  • Anomaly detection
  • Automation
  • Registration mark timing
  • Mobile equipement
  • Multiplication
  • High-performance memory-decoding or data-routing applications
  • Radiation therapy

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