TLV5610IYZT

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Manufacturer part number:TLV5610IYZT

Manufacturer:Rochester Electronics, LLC

Description:DAC Voltage - Buffered Surface Mount String DAC R

Case Package:SOT-23

Datasheet:TLV5610IYZT Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Surface Mount
Package / Case	20-WFBGA, DSBGA
Supplier Device Package	20-DSBGA
Operating Temperature	-40°C~85°C
Packaging	Tape & Reel (TR)
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Output Type	Voltage - Buffered
Number of Bits	12
Architecture	String DAC
Reference Type	External
Data Interface	SPI
Differential Output	No
Voltage - Supply, Analog	2.7V~3.3V 5V
Voltage - Supply, Digital	2.7V~3.3V 5V
Settling Time	7μs
INL/DNL (LSB)	±2, ±0.5
Number of D/A Converters	8
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$11.64000	$11.64
500	$11.5236	$5761.8
1000	$11.4072	$11407.2
1500	$11.2908	$16936.2
2000	$11.1744	$22348.8
2500	$11.058	$27645

TLV5610IYZT Overview

The package that contains this software is called 20-WFBGA, DSBGA. FPGA modules can be attached to development boards using a Surface Mount-connector. It is recommended that the operating temperature be kept within the range -40°C~85°C while the machine is operating. It is designed to maximiTape & Reel (TR)e space efficiency by containing the FPGA model in Tape & Reel (TR). The supplier of the device package is 20-DSBGA.