TLV5613IDWR

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Manufacturer part number:TLV5613IDWR

Manufacturer:Rochester Electronics, LLC

Description:DAC Voltage - Buffered Surface Mount String DAC R

Case Package:SOT-23

Datasheet:TLV5613IDWR Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Surface Mount
Package / Case	20-SOIC (0.295, 7.50mm Width)
Supplier Device Package	20-SOIC
Operating Temperature	-40°C~85°C
Packaging	Tape & Reel (TR)
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Output Type	Voltage - Buffered
Number of Bits	12
Architecture	String DAC
Reference Type	External
Data Interface	Parallel
Differential Output	No
Voltage - Supply, Analog	2.7V~3.3V 5V
Voltage - Supply, Digital	2.7V~3.3V 5V
Settling Time	7μs
INL/DNL (LSB)	±1.5, ±0.4
Number of D/A Converters	1
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$3.54000	$3.54
500	$3.5046	$1752.3
1000	$3.4692	$3469.2
1500	$3.4338	$5150.7
2000	$3.3984	$6796.8
2500	$3.363	$8407.5

TLV5613IDWR Overview

In the 20-SOIC (0.295, 7.50mm Width) package, you will find it. Surface Mount-connectors can be used to attach this FPGA module to the development board. As far as the operating temperature is concerned, it should be kept within -40°C~85°C when operating. Unlike other FPGA models, this one is contained in Tape & Reel (TR) for the sake of space saving. Its supplier package is called 20-SOIC.