It is supplied in the 20-SOIC (0.295, 7.50mm Width) package. This FPGA module can be attached to the development board with a Surface Mount. The operating temperature should be kept at -40°C~125°C when operating. This FPGA model is contained in Tube for space saving. It employs 20-SOIC as its supplier device package.
TLV5619QDW Features
20-SOIC (0.295, 7.50mm Width) package
TLV5619QDW Applications
There are a lot of Rochester Electronics, LLC TLV5619QDW Digital to Analog Converters (DAC) applications.