UCC3750N Overview

In order to save space on the board, the 28-DIP (0.600, 15.24mm) package is used.In order to pack telecommunications equipment, Tube is used.A Through Hole mounting type is used.A 1 circuit is the heart of this telecom IC .The voltage supplied to 5V can improve efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at 0°C~70°C.A 500μA supply current is required to operate telecom equipment .

UCC3750N Features

Available in the 28-DIP (0.600, 15.24mm) package

UCC3750N Applications

There are a lot of Rochester Electronics, LLC UCC3750N Telecom applications.

• Integrated Access Devices (IADs)
• High speed data transmission line cards
• LAN Routers
• Digital access cross connects
• Cross Connects
• Fractional T1/E1/J1
• High-Density T1/E1/J1 interfaces for Multiplexers
• CSU/DSU Equipment
• T1 Digital Cross Connects (DSX-1)
• CSU/DSU E1/T1/J1 Interface