UCC3751N Overview

In order to save space on the board, 16-DIP (0.300, 7.62mm) packages are used.To pack telecommunications equipment, the way of Tube is used.Mounting type Through Hole is used.1 circuits are used in this telecom IC .12V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A temperature setting of -55°C~125°C ensures reliable performance.The current supply is 1mA.

UCC3751N Features

Available in the 16-DIP (0.300, 7.62mm) package

UCC3751N Applications

There are a lot of Rochester Electronics, LLC UCC3751N Telecom applications.

• Residential Gateways
• Home Gateway
• Set-Top Box
• CSU/DSU Equipment
• Hybrid fiber coax (HFC)
• T3 channelized access concentrators
• T1/E1/J1 Multiplexer and Channel Banks
• Digital cross connects (DSX-1)
• SDH Multiplexers
• Fractional T1/E1/J1