XC3S50-4CPG132I Overview

In the package 132-TFBGA, CSPBGA, this product is provided. Having 89 I/Os makes data transfers more coherent. A fundamental building block contains 1728 logic elements or cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Spartan?-3 series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 73728 bFpga chipss. A total of 192 LABs/CLBs make up this FPGA array. 50000 gates make up the basic block of its construction. The supplier of the device package is 132-CSPBGA (8x8).

XC3S50-4CPG132I Features

89 I/Os
Up to 73728 RAM bits

XC3S50-4CPG132I Applications

There are a lot of Rochester Electronics, LLC XC3S50-4CPG132I FPGAs applications.

• Solar Energy
• Data center hardware accelerators
• Enterprise networking
• Automotive
• Computer hardware emulation
• Medical ultrasounds
• Random logic
• Automotive Applications
• Image processing
• Embedded Vision