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XC3S50AN-4FTG256C

XC3S50AN-4FTG256C

XC3S50AN-4FTG256C

Rochester Electronics, LLC

FPGAs Spartan?-3AN Series 256-LBGA

SOT-23

XC3S50AN-4FTG256C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Operating Temperature0°C~85°C TJ
PackagingTray
Series Spartan®-3AN
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.14V~1.26V
Number of I/O 195
Number of Logic Elements/Cells 1584
Total RAM Bits 55296
Number of Gates50000
Number of LABs/CLBs 176
RoHS StatusROHS3 Compliant
In-Stock:4060 items

XC3S50AN-4FTG256C Product Details

XC3S50AN-4FTG256C Overview


In the package 256-LBGA, this product is provided. Having 195 I/Os makes data transfers more coherent. A fundamental building block contains 1584 logic elements or cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 1.14V~1.26V . The Spartan?-3AN series FPGA is a type of FPGA that belongs to the Spartan?-3AN family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that this device offer is 55296. 176 LABs and CLBs are built into this FPGA. The building block that forms the basis of the system contains 50000 gates. As a supplier, 256-FTBGA (17x17) is responsible for the package of its devices.

XC3S50AN-4FTG256C Features


195 I/Os
Up to 55296 RAM bits

XC3S50AN-4FTG256C Applications


There are a lot of Rochester Electronics, LLC XC3S50AN-4FTG256C FPGAs applications.

  • Integrating multiple SPLDs
  • Server Applications
  • Aerospace and Defense
  • Wired Communications
  • Medical ultrasounds
  • OpenCL
  • Industrial,Medical and Scientific Instruments
  • DO-254
  • Development Boards and Shields for Microcontrollers
  • Digital signal processing

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