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XOMAP3530BCBB

XOMAP3530BCBB

XOMAP3530BCBB

Rochester Electronics, LLC

ARM® Cortex®-A8 Microprocessor OMAP-35xx Series 515-VFBGA, FCBGA

SOT-23

XOMAP3530BCBB Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 515-VFBGA, FCBGA
Supplier Device Package 515-POP-FCBGA (12x12)
Operating Temperature 0°C~90°C TJ
Packaging Tray
Series OMAP-35xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 600MHz
Core Processor ARM® Cortex®-A8
Voltage - I/O 1.8V 3.0V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR
USB USB 1.x (3), USB 2.0 (1)
Additional Interfaces HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSP Signal Processing; C64x+, Multimedia; NEON™ SIMD
Display & Interface Controllers LCD
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $66.73000 $66.73
500 $66.0627 $33031.35
1000 $65.3954 $65395.4
1500 $64.7281 $97092.15
2000 $64.0608 $128121.6
2500 $63.3935 $158483.75
XOMAP3530BCBB Product Details

XOMAP3530BCBB Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 515-VFBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~90°C TJ. The cpu microprocessor belongs to the OMAP-35xx series. The CPU is cored with a ARM® Cortex®-A8 processor. The CPU uses LPDDR RAM controllers. This microprocessor features interfaces HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART. In this CPU, I/O is set to 1.8V 3.0V. Suppliers offer a package of 515-POP-FCBGA (12x12).

XOMAP3530BCBB Features


ARM® Cortex®-A8 Core


XOMAP3530BCBB Applications


There are a lot of Rochester Electronics, LLC
XOMAP3530BCBB Microprocessor applications.


  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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