BU8763FV-E2 Overview

To save board space, the 16-LSSOP (0.173, 4.40mm Width) package is used.To pack telecommunications equipment, the way of Tape & Reel (TR) is used.A Surface Mount mounting type is used.1 circuits make up this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 2.7V~3.6V can be operated more efficiently.Using -20°C~70°C as the operating temperature can result in reliable performance.Mounted in the direction of Surface Mount.Telecom interfaces contain 16 pins.BU8763 can be used to locate related parts based on telecom switching's base part number.Ensure normal operation by setting the temperature to -20°C minimum.70°C is set to the maximum value to ensure normal operation.

BU8763FV-E2 Features

Available in the 16-LSSOP (0.173, 4.40mm Width) package

BU8763FV-E2 Applications

There are a lot of ROHM Semiconductor BU8763FV-E2 Telecom applications.

• SDH/SONET multiplexers
• Channel Banks
• Fiber In The Loop (FITL)
• Cable Modem
• Stations
• Fault Tolerant Systems
• Remote wireless modules
• Digital cross connects (DSX-1)
• Microwave transmission systems
• SDH Multiplexers