M386B4G70DM0-CMA30

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Manufacturer part number:M386B4G70DM0-CMA30

Manufacturer:Samsung Electronics

Description:M386B4G70DM0-CMA30 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M386B4G70DM0-CMA30 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
Module	DRAM Module
Module Density	32Gbyte
Number of Chip per Module	36
Chip Density (bit)	8G
Data Bus Width (bit)	72
Maximum Clock Rate (MHz)	1866
Chip Configuration	2Gx4
Chip Package Type	78FBGA
Typical Operating Supply Voltage (V)	1.5
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Commercial
Module Sides	Double
ECC Support	No
Number of Ranks	Quad
CAS Latency	13
Supplier Package	LRDIMM
Mounting	Socket
Package Height	30.35
Package Length	133.35
Package Width	4.8(Max)
PCB changed	240
Part Status	Obsolete
Pin Count	240
Organization	4Gx72
Module Type	240LRDIMM