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M393B2873GB0-CH908

M393B2873GB0-CH908

M393B2873GB0-CH908

Samsung Electronics

M393B2873GB0-CH908 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M393B2873GB0-CH908 Datasheet

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Specifications
Name Value
Type Parameter
ECCN (US) 4A994.a
HTS 8542.31.00.01
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 9
Chip Density (bit) 1G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 128Mx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 1310
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
ECC Support No
Number of Ranks Single
CAS Latency 9
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Part Status Obsolete
Pin Count 240
Organization 128Mx72
Module Type 240RDIMM

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