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M393B2G70BH0-CK0

M393B2G70BH0-CK0

M393B2G70BH0-CK0

Samsung Electronics

M393B2G70BH0-CK0 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M393B2G70BH0-CK0 Datasheet

non-compliant

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Specifications
Name Value
Type Parameter
Surface Mount NO
Number of Terminals 240
ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 20
Maximum Clock Rate (MHz) 1600
Chip Configuration 1Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 2800
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks Dual
Number of Chip Banks 8
CAS Latency 11
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Number of Words 2147483648 words
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Pbfree Code Yes
Part Status Obsolete
Additional Feature AUTO/SELF REFRESH; WD-MAX
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 240
JESD-30 Code R-XDMA-N240
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575 V
Power Supplies 1.5 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.425 V
Number of Ports 1
Operating Mode SYNCHRONOUS
Organization 2Gx72
Output Characteristics 3-STATE
Seated Height-Max 30.15 mm
Memory Width 72
Memory Density 154618822656 bit
PLL No
I/O Type COMMON
Memory IC Type DDR DRAM MODULE
Refresh Cycles 8192
Access Mode DUAL BANK PAGE BURST
Self Refresh Yes
Module Type 240RDIMM
Width 4 mm
Length 133.35 mm
RoHS Status Yes with exemptions

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