M393B5273DH0-CH9

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Manufacturer part number:M393B5273DH0-CH9

Manufacturer:Samsung Electronics

Description:M393B5273DH0-CH9 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M393B5273DH0-CH9 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
Module	DRAM Module
Module Density	4Gbyte
Number of Chip per Module	18
Chip Density (bit)	2G
Data Bus Width (bit)	72
Max. Access Time (ns)	0.255
Maximum Clock Rate (MHz)	1333
Chip Configuration	256Mx8
Chip Package Type	FBGA
Minimum Operating Supply Voltage (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Maximum Operating Supply Voltage (V)	1.575
Operating Current (mA)	1580
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Module Sides	Double
ECC Support	Yes
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	9
SPD EEPROM Support	Yes
Standard Package Name	DIMM
Supplier Package	RDIMM
Mounting	Socket
Package Height	30
Package Length	133.35
Package Width	4(Max)
PCB changed	240
Lead Shape	No Lead
Part Status	Obsolete
Pin Count	240
Organization	512Mx72
PLL	No
Self Refresh	Yes
Module Type	240DIMM
RoHS Status	RoHS Compliant