M471B5173DB0-YK000

new-10%

Manufacturer part number:M471B5173DB0-YK000

Manufacturer:Samsung Electronics

Description:M471B5173DB0-YK000 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M471B5173DB0-YK000 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
HTS	8473.30.11.40
Module	DRAM Module
Module Density	4Gbyte
Number of Chip per Module	8
Chip Density (bit)	4G
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1600
Chip Configuration	512Mx8
Chip Package Type	FBGA
Typical Operating Supply Voltage (V)	1.35
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Commercial
Module Sides	Double
ECC Support	No
Number of Ranks	Single
CAS Latency	11
Standard Package Name	DIM
Supplier Package	USODIMM
Mounting	Socket
Package Height	30
Package Length	67.6
Package Width	3.8(Max)
PCB changed	204
Lead Shape	No Lead
Part Status	Obsolete
Pin Count	204
Organization	512Mx64
Module Type	204USODIMM
RoHS Status	RoHS Compliant