M471B5173EB0-YK0

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M471B5173EB0-YK0

Manufacturer part number:M471B5173EB0-YK0

Manufacturer:Samsung Electronics

Description:M471B5173EB0-YK0 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M471B5173EB0-YK0 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Surface Mount	NO
Number of Terminals	204
Module	DRAM Module
Module Density	4Gbyte
Number of Chip per Module	8
Chip Density (bit)	4G
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1600
Chip Configuration	512Mx8
Chip Package Type	78FBGA
Minimum Operating Supply Voltage (V)	1.283/1.425
Typical Operating Supply Voltage (V)	1.35/1.5
Maximum Operating Supply Voltage (V)	1.45/1.575
Operating Current (mA)	570
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
ECC Support	Yes
Number of Ranks	Single
CAS Latency	11
Supplier Package	USODIMM
Mounting	Socket
Package Height	30
Package Length	67.6
Package Width	3.8(Max)
PCB changed	204
Number of Words	536870912 words
Package Shape	RECTANGULAR
Manufacturer	Samsung Semiconductor
Part Status	Obsolete
ECCN Code	EAR99
Additional Feature	AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
Technology	CMOS
Terminal Position	DUAL
Terminal Form	NO LEAD
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Number of Functions	1
Terminal Pitch	0.6 mm
Reach Compliance Code	compliant
Pin Count	204
JESD-30 Code	R-XDMA-N204
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.45 V
Power Supplies	1.35 V
Temperature Grade	OTHER
Supply Voltage-Min (Vsup)	1.283 V
Number of Ports	1
Operating Mode	SYNCHRONOUS
Supply Current-Max	0.97 mA
Organization	512Mx64
Output Characteristics	3-STATE
Seated Height-Max	30.15 mm
Memory Width	64
Standby Current-Max	0.06 A
Memory Density	34359738368 bit
I/O Type	COMMON
Memory IC Type	DDR DRAM MODULE
Refresh Cycles	8192
Access Mode	SINGLE BANK PAGE BURST
Self Refresh	YES
Module Type	204USODIMM
Width	3.8 mm
Length	67.6 mm
RoHS Status	RoHS Compliant