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RP10UT2PJ1R6CS

RP10UT2PJ1R6CS

RP10UT2PJ1R6CS

SAMSUNGSEMICONDUCTOR

RP10UT2PJ1R6CS datasheet pdf and Card Guides product details from SAMSUNGSEMICONDUCTOR stock available on our website

SOT-23

RP10UT2PJ1R6CS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status 6 Weeks
Mount Surface Mount
Mounting Type Press Fit, Through Hole
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 3
Operating Temperature -40°C ~ 110°C
Packaging Tape & Reel (TR)
Pbfree Code -
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) -
Number of Terminations 5
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Regulators
Voltage - Supply 10V ~ 40V
Base Part Number Vcej Qnp
Output Voltage 42 V
Output Type Adjustable
Interface -
Termination Type SOLDER
Operating Supply Current 700 μA
Nominal Supply Current 700 μA
Output Current 90 mA
Max Supply Current 10 mA
Slew Rate -
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4640 items

About RP10UT2PJ1R6CS

The RP10UT2PJ1R6CS from SAMSUNGSEMICONDUCTOR is a high-performance microcontroller designed for a wide range of embedded applications. This component features RP10UT2PJ1R6CS datasheet pdf and Card Guides product details from SAMSUNGSEMICONDUCTOR stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RP10UT2PJ1R6CS, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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