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SPMWUTHT327FD5GBVMS0

SPMWUTHT327FD5GBVMS0

SPMWUTHT327FD5GBVMS0

SAMSUNGSEMICONDUCTORINC

SPMWUTHT327FD5GBVMS0 datasheet pdf and Card Guides product details from SAMSUNGSEMICONDUCTORINC stock available on our website

SOT-23

SPMWUTHT327FD5GBVMS0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 3 days ago)
Lifecycle Status 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case -
Number of Pins 4
Operating Temperature -
Packaging Bulk
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code -
Temperature Coefficient -
Subcategory Other Regulators
Voltage - Supply 4V ~ 30V
Base Part Number Jlsjpe Rxfl
Output Voltage 63 V
Output Type Transistor Driver
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current -
Output Current 70 mA
Max Supply Current 80 μA
Slew Rate 0.3V/μs
Architecture -
Amplifier Type General Purpose
In-Stock:3486 items

About SPMWUTHT327FD5GBVMS0

The SPMWUTHT327FD5GBVMS0 from SAMSUNGSEMICONDUCTORINC is a high-performance microcontroller designed for a wide range of embedded applications. This component features SPMWUTHT327FD5GBVMS0 datasheet pdf and Card Guides product details from SAMSUNGSEMICONDUCTORINC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SPMWUTHT327FD5GBVMS0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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