ERF8-025-07.0-S-DV-EGP-TR

new-10%

Manufacturer part number:ERF8-025-07.0-S-DV-EGP-TR

Manufacturer:Samtec Inc.

Description:Conn Micro High Speed Socket Strip SKT 50 POS 0.8mm Solder ST SMD T/R

Case Package:SOT-23

Datasheet:ERF8-025-07.0-S-DV-EGP-TR Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	BERYLLIUM COPPER
Mounting Type	Surface Mount
Insulation Material	LIQUID CRYSTAL POLYMER (LCP)
Mounting Option 1	LOCKING
Packaging	Tape & Reel (TR)
Series	Edge Rate™ ERF8
JESD-609 Code	e3
Feature	Board Guide
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	Socket, Outer Shroud Contacts
Number of Positions	50
Number of Rows	2
Gender	Female
Additional Feature	EDGE RATE CONTACT, E.L.P
Subcategory	Headers and Edge Type Connectors
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Mixed Contacts	NO
Option	GENERAL PURPOSE
Pitch	0.031 0.80mm
Total Number of Contacts	50
Number of Conductors	ONE
Reference Standard	UL
Contact Finish	Gold
Reliability	COMMERCIAL
Number Of PCB Rows	2
PCB Contact Pattern	RECTANGULAR
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Operating Temperature (Min)	-55°C
Contact Style	BELLOWED TYPE
Polarization Key	POLARIZED HOUSING
PCB Contact Row Spacing	4.4958 mm
Contact Pattern	RECTANGULAR
Insulator Color	BLACK
Contact Finish Thickness	30.0μin 0.76μm
Plating Thickness	30μin
Height Above Board	0.285 7.24mm
Stack Height (Mating)	9mm 12mm 15mm 16mm 22mm
RoHS Status	ROHS3 Compliant