HDAM-11-17.0-S-13-2 Overview

Packaging is in the form of High Density Array, Male.An orange Tray case is used to package the product.This device has a Surface Mount mounting type.Specifically, it is one of the products in the HD Mezz™ HDAM Series.In operation, Board Guide can be maintained as long as Board Guide is unchanged.A Surface Mount socket is required for the mounting of this part.If the temperature is below 125°C, it's best to use it.-55°C is the minimum temperature for this device.Other features include FINAL INCH, HD MEZZ, to name just a few.

HDAM-11-17.0-S-13-2 Features

HD Mezz™ HDAM series
Package / Case: Tray
Mounting Type:Surface Mount
Max Operating temperature at -55°C
Additional Feature: FINAL INCH, HD MEZZ

HDAM-11-17.0-S-13-2 Applications

There are a lot of Samtec Inc.
HDAM-11-17.0-S-13-2 Rectangular Connectors applications.

• Embedded systems
• Datacom
• Communication
• Medical technology
• Military Technology
• Measuring & Control Technology
• Instrumentation
• Automotive Electronics
• Telecommunications
• Data Technology