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HLE-104-02-L-DV-BE-LC

HLE-104-02-L-DV-BE-LC

HLE-104-02-L-DV-BE-LC

Samtec Inc.

2 RowsReceptacle, Bottom EntrySolderBeryllium CopperSurface MountTubeGoldLiquid Crystal Polymer (LCP)8 PositionsFemale Socket

SOT-23

HLE-104-02-L-DV-BE-LC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tube
Series HLE
JESD-609 Code e3
Feature Board Lock
Pbfree Code yes
Part Status Active
Termination Solder
Connector Type Receptacle, Bottom Entry
Number of Positions 8
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Additional Feature TIGER BEAM CONTACT
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 8
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 10.0μin 0.25μm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2.73000 $2.73
HLE-104-02-L-DV-BE-LC Product Details

HLE-104-02-L-DV-BE-LC Overview


The packaging contains Receptacle, Bottom Entry.Surface Mount indicates that the device is mounted.In order to package the product, a Tube case is used.The product is part of the HLE Series.There are also features like TIGER BEAM CONTACT, just to name a few.A number of features make it more powerful because of its Board Lock feature.Device runs at -55°C~125°C Operating Temperature.

HLE-104-02-L-DV-BE-LC Features


HLE series

HLE-104-02-L-DV-BE-LC Applications


There are a lot of Samtec Inc. HLE-104-02-L-DV-BE-LC Rectangular Connectors applications.

  • Transportation
  • Medical technology
  • Industrial Automation
  • Instrumentation
  • Embedded systems
  • Military Technology
  • Telecommunications
  • Measuring & Control Technology
  • Automotive Electronics
  • Data Technology

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