HLE-110-02-G-DV-A

new-10%

HLE-110-02-G-DV-A

Manufacturer part number:HLE-110-02-G-DV-A

Manufacturer:Samtec Inc.

Description:2 RowsReceptacleSolderBeryllium CopperSurface MountTubeGoldLiquid Crystal Polymer (LCP)20 PositionsFemale Socket

Case Package:SOT-23

Datasheet:HLE-110-02-G-DV-A Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Beryllium Copper
Mounting Type	Surface Mount
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Housing Material	Polymer
Mounting Option 1	LOCKING
Operating Temperature	-55°C~125°C
Packaging	Tube
Published	2011
Series	HLE
JESD-609 Code	e4
Feature	Board Guide
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Connector Type	Receptacle
Number of Positions	20
Number of Rows	2
Gender	Female
Voltage - Rated	400VAC
Additional Feature	TIGER BEAM CONTACT
HTS Code	8536.69.40.40
Fastening Type	Push-Pull
Subcategory	Headers and Edge Type Connectors
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Female Socket
Mixed Contacts	NO
Option	GENERAL PURPOSE
Current Rating (Amps)	4.1A per Contact
Total Number of Contacts	20
Orientation	Straight
Depth	5.08mm
Insulation Height	0.144 3.66mm
Style	Board to Board
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Insulation Color	Black
Number of Conductors	ONE
Reference Standard	UL, CSA
Reliability	COMMERCIAL
Row Spacing - Mating	0.100 (2.54mm)
Number Of PCB Rows	2
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.144 inch
Mating Contact Pitch	0.1 inch
Max Voltage Rating (AC)	400V
Max Current Rating	2.5A
PCB Contact Row Spacing	5.0546 mm
Insertion Force-Max	.556 N
Withdrawl Force-Min	.4448 N
Length	25.4mm
Plating Thickness	10μin
Contact Finish Thickness - Mating	20.0μin 0.51μm
Contact Finish Thickness - Post	3.00μin 0.076μm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant