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HLE-112-02-LM-DV-TE

HLE-112-02-LM-DV-TE

HLE-112-02-LM-DV-TE

Samtec Inc.

2 RowsReceptacleSolderBeryllium CopperThrough HoleTubeGoldLiquid Crystal Polymer (LCP)24 PositionsFemale Socket

SOT-23

HLE-112-02-LM-DV-TE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Series HLE
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Receptacle
Number of Positions 24
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Additional FeatureTOP ENTRY
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Insulation Height 0.138 3.50mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Contact Finish - Post Tin
Contact Finish Thickness - Mating 10.0μin 0.25μm
RoHS StatusROHS3 Compliant
In-Stock:4538 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.28000$3.28

HLE-112-02-LM-DV-TE Product Details

HLE-112-02-LM-DV-TE Overview


This product is packaged in a Receptacle box.Mounting type Through Hole is assigned to the device.It has been determined that a Tube case is necessary to package the product.The product is part of the HLE Series.Furthermore, there are other features such as TOP ENTRY, to name a few.Through Hole is mounting the part.There is no operating temperature for the device.

HLE-112-02-LM-DV-TE Features


HLE series

HLE-112-02-LM-DV-TE Applications


There are a lot of Samtec Inc. HLE-112-02-LM-DV-TE Rectangular Connectors applications.

  • Measuring & Control Technology
  • Data Technology
  • Military Technology
  • Embedded systems
  • Datacom
  • Instrumentation
  • Transportation
  • Medical technology
  • Telecommunications
  • Automotive Electronics

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