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HLE-113-02-G-DV-BE-K

HLE-113-02-G-DV-BE-K

HLE-113-02-G-DV-BE-K

Samtec Inc.

HLE-113-02-G-DV-BE-K datasheet pdf and Rectangular Connectors - Headers, Receptacles, Female Sockets product details from Samtec Inc. stock available on our website

SOT-23

HLE-113-02-G-DV-BE-K Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tube
Series HLE
JESD-609 Code e4
Feature Pick and Place
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Receptacle, Bottom Entry
Number of Positions 26
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
HTS Code 8536.69.40.40
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 26
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish Thickness - Mating 20.0μin 0.51μm
Contact Finish Thickness - Post 3.00μin 0.076μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $5.38000 $5.38
HLE-113-02-G-DV-BE-K Product Details

HLE-113-02-G-DV-BE-K Overview


The product comes in a package of Receptacle, Bottom Entry.Surface Mount is the mounting type.It has been determined that a Tube case is necessary to package the product.This product is in the HLE Series.Several benefits come from the Pick and Place feature.Operating temperature is -55°C~125°C.

HLE-113-02-G-DV-BE-K Features


HLE series

HLE-113-02-G-DV-BE-K Applications


There are a lot of Samtec Inc. HLE-113-02-G-DV-BE-K Rectangular Connectors applications.

  • Transportation
  • Automotive Electronics
  • Telecommunications
  • Military Technology
  • Industrial Automation
  • Medical technology
  • Datacom
  • Embedded systems
  • Instrumentation
  • Communication

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