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HLE-114-02-F-DV-TE

HLE-114-02-F-DV-TE

HLE-114-02-F-DV-TE

Samtec Inc.

2 RowsReceptacleSolderBeryllium CopperThrough HoleTubeGoldLiquid Crystal Polymer (LCP)28 PositionsFemale Socket

SOT-23

HLE-114-02-F-DV-TE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tube
Series HLE
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Receptacle
Number of Positions 28
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Additional Feature TIGER BEAM CONTACT; TOP ENTRY
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Insulation Height 0.138 3.50mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Contact Finish - Post Tin
Contact Finish Thickness - Mating 3.00μin 0.076μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.20000 $3.2
HLE-114-02-F-DV-TE Product Details

HLE-114-02-F-DV-TE Overview


A Receptacle packaging is included.Through Hole is the mounting type for the device.To package the product, a Tube case is used.As a product of the HLE Series, it can be found in this category.Other features include TIGER BEAM CONTACT; TOP ENTRY, to name just a few.-55°C~125°C Operating Temperature is what the device runs at.

HLE-114-02-F-DV-TE Features


HLE series

HLE-114-02-F-DV-TE Applications


There are a lot of Samtec Inc. HLE-114-02-F-DV-TE Rectangular Connectors applications.

  • Industrial Automation
  • Data Technology
  • Datacom
  • Medical technology
  • Telecommunications
  • Embedded systems
  • Automotive Electronics
  • Instrumentation
  • Military Technology
  • Communication

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