Welcome to Hotenda.com Online Store!

logo
userjoin
Home

HLE-114-02-L-DV-BE

HLE-114-02-L-DV-BE

HLE-114-02-L-DV-BE

Samtec Inc.

2 RowsReceptacle, Bottom EntrySolderBeryllium CopperSurface MountTubeGoldLiquid Crystal Polymer (LCP)28 PositionsFemale Socket

SOT-23

HLE-114-02-L-DV-BE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tube
Published 2016
Series HLE
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Termination Solder
Connector Type Receptacle, Bottom Entry
Number of Positions 28
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 28
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 10.0μin 0.25μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $4.68000 $4.68
HLE-114-02-L-DV-BE Product Details

HLE-114-02-L-DV-BE Overview


It comes in Receptacle, Bottom Entry packaging.Its mounting type is Surface Mount.This product is packaged in a case marked Tube.It is part of the HLE Series of products.The device is operating at -55°C~125°C Operating Temperature.

HLE-114-02-L-DV-BE Features


HLE series

HLE-114-02-L-DV-BE Applications


There are a lot of Samtec Inc. HLE-114-02-L-DV-BE Rectangular Connectors applications.

  • Automotive Electronics
  • Industrial Automation
  • Medical technology
  • Military Technology
  • Datacom
  • Data Technology
  • Measuring & Control Technology
  • Transportation
  • Communication
  • Embedded systems

Related Part Number

Get Subscriber

Enter Your Email Address, Get the Latest News