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HLE-117-02-G-DV-LC-P-TR

HLE-117-02-G-DV-LC-P-TR

HLE-117-02-G-DV-LC-P-TR

Samtec Inc.

2 Rows Receptacle Solder Beryllium Copper Surface Mount Tape & Reel (TR) Gold Liquid Crystal Polymer (LCP) 34 Positions Female Socket

SOT-23

HLE-117-02-G-DV-LC-P-TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series HLE
JESD-609 Code e4
Feature Board Lock, Pick and Place
Part Status Active
Termination Solder
Connector Type Receptacle
Number of Positions 34
Number of Rows 2
Gender Female
Voltage - Rated 400VAC
Additional Feature TIGER BEAM CONTACT
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Total Number of Contacts 34
Insulation Height 0.144 3.66mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish Thickness - Mating 20.0μin 0.51μm
Contact Finish Thickness - Post 3.00μin 0.076μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
125 $4.54400 $568
HLE-117-02-G-DV-LC-P-TR Product Details

HLE-117-02-G-DV-LC-P-TR Overview


A Receptacle package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tape & Reel (TR) case.It is part of the HLE Series of products.Additionally, there are other features, such as TIGER BEAM CONTACT.A number of features make it more powerful because of its Board Lock, Pick and Place feature.There is no operating temperature for the device.

HLE-117-02-G-DV-LC-P-TR Features


HLE series


HLE-117-02-G-DV-LC-P-TR Applications


There are a lot of Samtec Inc.
HLE-117-02-G-DV-LC-P-TR Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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