Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Beryllium Copper
Mount	Surface Mount
Mounting Type	Surface Mount
Housing Material	Polymer
Material - Insulation	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C~125°C
Packaging	Tray
Published	2013
Series	Edge Rate™ HSEC8
JESD-609 Code	e3
Feature	Board Guide, Locking Ramp
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	CARD EDGE CONNECTOR
Number of Positions	120
Color	Black
Number of Rows	2
Gender	Female
Subcategory	Headers and Edge Type Connectors
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Cantilever
Mixed Contacts	NO
Option	GENERAL PURPOSE
Pitch	0.031 0.80mm
Total Number of Contacts	120
Orientation	Straight
Number of Conductors	ONE
Contact Finish	Gold
Reliability	COMMERCIAL
Number Of PCB Rows	2
Body Depth	0.314 inch
Contact Resistance	15mOhm
Card Type	Non Specified - Dual Edge
Read Out	Dual
Insulation Resistance	1000000000Ohm
Number of Positions/Bay/Row	60
Body/Shell Style	SOCKET
Durability	1000 Cycles
Contact Finish Thickness	30.0μin 0.76μm
Plating Thickness	30μin
Card Thickness	0.062 1.57mm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant

HSEC8-160-01-S-DV-A-K

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