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HTSW-219-07-SS-S

HTSW-219-07-SS-S

HTSW-219-07-SS-S

Samtec Inc.

HTSW Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 19-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

HTSW-219-07-SS-S Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Housing Material Polymer
Operating Temperature -55°C~125°C
Packaging Bulk
Series HTSW
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header
Number of Positions 19
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) Varies by WireGAuge
Orientation Straight
Terminal Pitch 5.08mm
Depth 2.48mm
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.200 5.08mm
Insulation Color Natural
Number of Conductors ONE
Reliability COMMERCIAL
Contact Length - Post 0.100 2.54mm
Shrouding Unshrouded
Number Of PCB Rows 1
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
PCB Contact Pattern RECTANGULAR
Body Breadth 0.098 inch
Overall Contact Length 0.430 10.92mm
Mating Contact Pitch 0.2 inch
Max Voltage Rating (AC) 550V
Length 48.26mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $4.18000 $4.18
HTSW-219-07-SS-S Product Details

HTSW-219-07-SS-S Overview


It comes in Header packaging.The device's mounting type is Through Hole.In order to package the product, a Bulk case is used.It belongs to the HTSW Series of products.The device runs in -55°C~125°C Operating Temperature.

HTSW-219-07-SS-S Features


HTSW series


HTSW-219-07-SS-S Applications


There are a lot of Samtec Inc.
HTSW-219-07-SS-S Rectangular Connectors applications.


  • Industrial Automation
  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics

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