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QMSS-032-06.75-H-D-DP-PC4

  • QMSS-032-06.75-H-D-DP-PC4
  • QMSS-032-06.75-H-D-DP-PC4

QMSS-032-06.75-H-D-DP-PC4

QMSS-032-06.75-H-D-DP-PC4

Samtec Inc.

Differential Pair Array, Male Tray 2 Rows 0.025 0.64mm Surface Mount 64 Positions Q2™ QMSS Gold Solder

SOT-23

QMSS-032-06.75-H-D-DP-PC4 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Mount Through Hole
Mounting Type Surface Mount
Packaging Tray
Series Q2™ QMSS
JESD-609 Code e4
Feature Board Guide, Ground Bus (Plane), Power Pins (4), Shielded
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Differential Pair Array, Male
Number of Positions 64
Number of Rows 2
Gender Male
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts YES
Option GENERAL PURPOSE
Pitch 0.025 0.64mm
Total Number of Contacts 72
Contact Finish Gold
Contact Finish Thickness 30.0μin 0.76μm
Height Above Board 0.265 6.73mm
Stack Height (Mating) 11mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $28.29000 $28.29
QMSS-032-06.75-H-D-DP-PC4 Product Details

QMSS-032-06.75-H-D-DP-PC4 Overview


Packaging for this item is Differential Pair Array, Male.It is necessary to use a Tray case for packaging the product.There is a mounting type of Surface Mount for this device.This product is part of the Q2™ QMSS Series.In operation, it is possible to ensure that Board Guide, Ground Bus (Plane), Power Pins (4), Shielded is maintained.This part requires a Through Hole socket for mounting.

QMSS-032-06.75-H-D-DP-PC4 Features


Q2™ QMSS series
Package / Case: Tray
Mounting Type:Surface Mount


QMSS-032-06.75-H-D-DP-PC4 Applications


There are a lot of Samtec Inc.
QMSS-032-06.75-H-D-DP-PC4 Rectangular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications

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