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RSM-111-02-L-D-LC-P

RSM-111-02-L-D-LC-P

RSM-111-02-L-D-LC-P

Samtec Inc.

2 RowsReceptacleSolderPhosphor BronzeSurface MountBulkGoldLiquid Crystal Polymer (LCP)22 PositionsFemale Socket

SOT-23

RSM-111-02-L-D-LC-P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Bulk
Series RSM
JESD-609 Code e3
Feature Board Lock, Pick and Place
Pbfree Code yes
Part Status Active
Termination Solder
Connector Type Receptacle
Number of Positions 22
Number of Rows 2
Gender Female
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3.1A per Contact
Total Number of Contacts 22
Insulation Height 0.240 6.10mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.050 1.27mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
UL Flammability Code 94V-0
Contact Finish Thickness - Mating 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
500 $3.53700 $1768.5
RSM-111-02-L-D-LC-P Product Details

RSM-111-02-L-D-LC-P Overview


The packaging contains Receptacle.Its mounting type is Surface Mount.In order to package the product, a Bulk case is used.This product is in the RSM Series.In many ways, its Board Lock, Pick and Place feature makes it more powerful.Device runs at -55°C~125°C Operating Temperature.

RSM-111-02-L-D-LC-P Features


RSM series

RSM-111-02-L-D-LC-P Applications


There are a lot of Samtec Inc. RSM-111-02-L-D-LC-P Rectangular Connectors applications.

  • Industrial Automation
  • Automotive Electronics
  • Measuring & Control Technology
  • Data Technology
  • Transportation
  • Military Technology
  • Embedded systems
  • Instrumentation
  • Telecommunications
  • Medical technology

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