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TLE-119-01-G-DV-A-P

TLE-119-01-G-DV-A-P

TLE-119-01-G-DV-A-P

Samtec Inc.

2 RowsReceptacle, Pass ThroughSolderPhosphor BronzeSurface MountTubeGoldLiquid Crystal Polymer (LCP)38 PositionsFemale Socket

SOT-23

TLE-119-01-G-DV-A-P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tube
Series TLE
JESD-609 Code e4
Feature Board Guide, Pick and Place
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Pass Through
Number of Positions 38
Number of Rows 2
Gender Female
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3.2A per Contact
Total Number of Contacts 38
Insulation Height 0.177 4.50mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Row Spacing - Mating 0.079 (2.00mm)
Contact Finish Thickness - Mating 10.0μin 0.25μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $6.05000 $6.05
TLE-119-01-G-DV-A-P Product Details

TLE-119-01-G-DV-A-P Overview


Currently, it is packaged in Receptacle, Pass Through.Mounting type is Surface Mount.A Tube case is used to package the product.There is a product in the TLE Series.This feature renders it more powerful in a number of ways because of its Board Guide, Pick and Place feature.It operates at an operating temperature of -55°C~125°C.

TLE-119-01-G-DV-A-P Features


TLE series

TLE-119-01-G-DV-A-P Applications


There are a lot of Samtec Inc. TLE-119-01-G-DV-A-P Rectangular Connectors applications.

  • Measuring & Control Technology
  • Instrumentation
  • Data Technology
  • Transportation
  • Communication
  • Datacom
  • Telecommunications
  • Military Technology
  • Industrial Automation
  • Embedded systems

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