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TSM-110-03-S-DV-A-P

TSM-110-03-S-DV-A-P

TSM-110-03-S-DV-A-P

Samtec Inc.

CONN HEADER SMD 20POS 2.54MM

SOT-23

TSM-110-03-S-DV-A-P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Board Mounting Option PEG
Operating Temperature -55°C~125°C
Packaging Tube
Series TSM
JESD-609 Code e3
Feature Board Guide, Pick and Place
Pbfree Code yes
Part Status Active
Termination Solder
Connector Type Header
Number of Positions 20
Number of Rows 2
Additional Feature E.L.P.
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 20
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Reach Compliance Code not_compliant
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Number of Conductors ONE
Reliability COMMERCIAL
Body Length or Diameter 1 inch
Row Spacing - Mating 0.100 (2.54mm)
Shrouding Unshrouded
Number Of PCB Rows 2
Contact Finish - Post Tin
Contact Length - Mating 0.420 10.67mm
PCB Contact Pattern RECTANGULAR
Body Depth 0.15 inch
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 4.953 mm
Plating Thickness 30μin
Contact Finish Thickness - Mating 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $4.48000 $4.48

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