TSW-108-08-G-D-RA

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TSW-108-08-G-D-RA

Manufacturer part number:TSW-108-08-G-D-RA

Manufacturer:Samtec Inc.

Description:TSW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole, Right Angle Gold Polybutylene Terephthalate (PBT) 16-Position Board to Board or Cable 0.219 5.56mm Height

Case Package:SOT-23

Datasheet:TSW-108-08-G-D-RA Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	1 Weeks
Contact Material	Phosphor Bronze
Mount	Through Hole
Mounting Type	Through Hole, Right Angle
Contact Shape	Square
Insulation Material	Polybutylene Terephthalate (PBT)
Housing Material	Polyester
Operating Temperature	-55°C~125°C
Packaging	Bulk
Series	TSW
Published	2005
JESD-609 Code	e4
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	Header
Number of Positions	16
Number of Rows	2
Gender	Male
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Option	GENERAL PURPOSE
Orientation	Right Angle
Depth	12.44mm
Insulation Height	0.219 5.56mm
Style	Board to Board or Cable
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Number of Conductors	ONE
Reference Standard	UL
Reliability	COMMERCIAL
Row Spacing - Mating	0.100 (2.54mm)
Contact Length - Post	0.090 2.29mm
Shrouding	Unshrouded
Number Of PCB Rows	2
Lead Pitch	2.54mm
Contact Length - Mating	0.230 5.84mm
PCB Contact Pattern	RECTANGULAR
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Body Breadth	0.1 inch
Housing Color	Black
Mating Contact Pitch	0.1 inch
Max Voltage Rating (AC)	450V
Max Current Rating	7.6A
PCB Contact Row Spacing	5.08 mm
Length	20.32mm
Width	2.54mm
Plating Thickness	10μin
Contact Finish Thickness - Mating	10.0μin 0.25μm
Contact Finish Thickness - Post	3.00μin 0.076μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
Radiation Hardening	No
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free