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DW01UT19SS860

DW01UT19SS860

DW01UT19SS860

SAMTECINC

DW01UT19SS860 datasheet pdf and Batteries Non-Rechargeable (Primary) product details from SAMTECINC stock available on our website

SOT-23

DW01UT19SS860 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status 30 Weeks
Mount Press Fit, Through Hole
Mounting Type Flanges
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 4
Operating Temperature -40°C ~ 110°C
Packaging -
Pbfree Code yes
Part Status -
Moisture Sensitivity Level (MSL) 1
Number of Terminations 3
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply 10V ~ 40V
Base Part Number Hiwku Alpn
Output Voltage 25 V
Output Type Analog Voltage
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 700 μA
Nominal Supply Current 700 μA
Output Current 60 mA
Max Supply Current 1 μA
Slew Rate 0.6V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:1909 items

About DW01UT19SS860

The DW01UT19SS860 from SAMTECINC is a high-performance microcontroller designed for a wide range of embedded applications. This component features DW01UT19SS860 datasheet pdf and Batteries Non-Rechargeable (Primary) product details from SAMTECINC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DW01UT19SS860, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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